Lead-Free Solder Balls,BGA Lead‑Free Solder Ball Tin Balls 25W for PCB Board Rework Reballing Accessories 0.55MM
Product details
| Management number | 209981585 | Release Date | 2026/04/02 | List Price | $12.66 | Model Number | 209981585 | ||
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Specification: Item Type: BGA Lead‑Free Solder Ball Product Composition: Sn96.5%/Ag3%/Cu0.5% Specification: Approx. 0.55mm / 0.02in 250,000 grains Purpose: Chip planting beads and ball planting Scope of Application: BGA package soldering, filling, maintenance, ball planting Package List:1 Bottle of Tin Balls
- widely used in ultra‑small spherical tin electronic parts that connect semiconductor chips, circuit templates and PCB boards, and transmit electronic signals.
- The diameter of the solder ball for IC packaging is approx. 0.2 ~ 0.76mm / 0.01 ~ 0.03in.
- Trace elements are added to the solder balls to improve the oxidation ability and reliability of the solder balls
- Refined materials are environmentally friendly and lead‑free, and strengthen the solder ball soldering ability
- With a large number, can meet your use and replacement needs, very practically
| Item Weight | 7 ounces |
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| Manufacturer | EVTSCAN |
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